Broadband convergence trend Ethernet will become a unified technology

CONTENT

 

Broadcom Corporation (Broadcom) senior vice president and general manager of the Department of enterprise network Nariman Mr. Yousefi in IIC China days before the Wuhan conference issued a "massive content delivery and Internet data center" of the excellent report, he pointed out, "as we know, they are changing the face of broadband communication."

 

Broadband convergence trend Ethernet will become a unified technology

At present, phone calls, cable TV, satellite, wireless, fiber and other broadband technology is becoming increasingly close, voice, video and data flow is explosive growth, "with the development of universal broadband Internet access bandwidth, the massive increase in mobile and wireless technology as well as the development of semiconductor integrated and super chip" "come out, will greatly promote the development of broadband fusion."

 

The future of broadband market growth will appear three trends, one is the integration of business and residential Ethernet, two is the triple play back access technology migration from the ATM to the Ethernet network, three is from business migration to Ethernet leased line.

 

Triple play, "broadband bandwidth surge, the current development trend is driven by 100 times in the network construction of the previous generation speed," said Yousefi, as the key technology of Ethernet Broadband convergence will be unified and the rapid development of technology.

 

For example, the revenue model of wireless access is changing: from the traditional TDM based network to Ethernet based network, Ethernet can make the cost curve bending (see Figure 1)." The higher rate of Ethernet is the 3 market penetration of

enterprise, data center and telecom operators.

 

 

The design of next generation network chips faces 4 challenges

Yousefi pointed out that the next generation of network chip design focused on the architecture and design, I/O and memory, packaging and power, process and other 4 areas.

 

The evolution of I/O technology is linear, faster and faster, and now the development of 100Gbps, in which optical and electrical interconnection, "the next 3 years, 10Gb/s power transmission is the most effective, but optical interconnect solutions must be competitive in the $/Gb/ capacity, with very high density or cover a very large range, superior optical interconnection."

 

Yousefi at the same time on the current hot plug 10G modules were compared, including SFP / SFP+, XFP, XPAK or X2, XENPAK, both from the size or power point of view, SFP / SFP+ are the best.

 

But there are still many challenges in terms of encapsulation and I/O speed, OC-768 transceiver package as an example, challenges include: encapsulation and substrate with simulation, power and heat dissipation, wire connection or flip chip, and assembly problems. "In particular, heat challenges must focus on."

 

The power and heat also caused concern on such Ethernet industry, such as port number 3 speed switch many of the linear relationship between the power and the effective number of links, the invalid link to LPI, the total power saving striking. For the 10G system with a small number of ports, the no-load power savings on a single link are noticeable. "EEE can save over 50% of power consumption by idle time."

 

 

"But to achieve market success, global standards are needed." Yousefi said, making the current IEEE and ITU organization is to strengthen the relevant standards, such as IEEE for LAN cable IEEE 802.1 / 802.3, 1G / Ethernet / PHY to 10G EPON, 40G / 100G Ethernet, power over Ethernet, AV bridging / time synchronization, congestion management / security standard, ITU-T, SG15 ATIS and DSL forum is responsible for VDSL / VDSL2, ADSL2 / 2+ and passive optical network (PON) production standard.

 

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